Kelington Group Secures RM1.83 Bln Works Contract In India

KUALA LUMPUR, Sept 14 (Bernama) -- Integrated engineering solutions provider Kelington Group Bhd has secured a RM 1.83 billion turnkey project from a leading semiconductor manufacturer in India.

Kelington said its wholly owned subsidiary, Kelington Engineering (S) Pte Ltd (KESG), has accepted a letter of award (LoA) for turnkey total facility tool hookup services for a semiconductor wafer fabrication facility in Gujarat, India.

“Under the LoA, Kelington will act as the main contractor and undertake the overall design, installation, connection, testing and handover of manufacturing, laboratory and support tools, together with related tool-specific support systems for Module 1 and Module 2 of the facility.

“The works are expected to be completed over a period of 30 months, with completion targeted by February 2029,” it said.

Meanwhile, Kelington chief executive officer Lim Seng Chuan said the contract marks the largest project the group has secured, providing an important platform to deepen its presence in the semiconductor industry and create opportunities for further growth.

“It marks another important step in elevating our contracting and management capabilities to become a main contractor in semiconductor turnkey total facility tool hookup services.

“Turnkey total facility tool hookup is a critical part of bringing semiconductor manufacturing equipment into operation, requiring close coordination across multiple engineering disciplines and stringent execution standards,” he said

Lim added that Kelington is well positioned to leverage India’s significant investments to build its domestic semiconductor manufacturing capabilities, while further strengthening its presence in the market.

For the six months ended June 30, 2026, Kelington secured RM1.23 billion in new contracts, including subsequent contract wins of RM538 million and the RM1.83 billion hookup contract; its total year-to-date wins stood at RM3.59 billion.

-- BERNAMA