Mi Equipment To Expand Advanced Packaging R&D, Manufacturing Capacity In Penang
GEORGE TOWN, July 28 (Bernama) -- Mi Equipment (M) Sdn Bhd will continue expanding its research and development (R&D) capabilities and manufacturing capacity in Penang as it strengthens its position as a global player in the advanced semiconductor packaging industry.
Its chief executive officer (CEO) Teo Chee Kheong said the company’s future growth strategy would focus on advancing its core technologies, particularly in die sorting, artificial intelligence (AI) applications and bonding solutions, while developing local talent to support the semiconductor ecosystem.
“Moving forward, we want to continue our R&D pursuit in the advanced packaging space to become a global leader in whatever we do -- die sorting, AI applications and especially bonding.
“At this facility, we will continue to expand our manufacturing capacity and capabilities, creating stable employment, more career opportunities and stronger employee engagement, while working with universities and institutions to develop local talent,” he said during a media briefing after a visit by Penang Chief Minister Chow Kon Yeow to Mi Equipment’s facility here today. Also present was Mi Technovation Group CEO Oh Kuang Eng.
Teo said the company would continue investing millions of dollars in new processes, technology and human capital to support its growth and strengthen its role in serving the semiconductor industry.
Teo said Mi Equipment, which was founded in Penang in 2007, had grown from a local technology company into a global semiconductor equipment provider through continuous innovation.
“When we started, we believed in innovation and contributing to the semiconductor industry. That was why we entered the advanced packaging space when not many companies wanted to venture into it.
“We developed our turret-based die sorter and, through hard work, gained market access locally before expanding overseas to countries such as the United States, Taiwan and China,” he said.
Teo said the company’s flagship Mi series achieved significant market dominance in 2014, strengthening its position as a major player in die sorting technology and the company was subsequently listed on Bursa Malaysia after just 10 years of operation, marking a new phase of growth and diversification.
Following its listing, Mi Equipment embarked on a new 10-year roadmap, expanding beyond its core business into areas including smart binning for high-performance computing (HPC), bonding, AI-driven applications and advanced die-level testing.
He said the company’s Penang facility, established in 2019, had become a key manufacturing hub producing hundreds of semiconductor equipment units for customers worldwide and while diversifying, they continue to strengthen the core and also developed a one-of-a-kind AI-enabled die sorter that reaffirms the position in the industry.
Currently, Mi Equipment operates a manufacturing facility in Suzhou, China, supported by seven overseas sales and service offices globally as well as an R&D centre in Singapore and the company has more than 330 employees, serves over 90 customers and has installed more than 1,300 machines worldwide.
Teo said innovation remained the backbone of the company, with more than 110 intellectual property (IP) rights granted across its three main technology segments -- bonding, sorting and die-level testing.
He added that Mi Equipment was well positioned to benefit from the current AI-driven semiconductor growth cycle, particularly through its involvement in key segments including mobile and wearable devices, HPC and memory as well as automotive applications such as electric vehicles, solar farms and wind energy.
“AI infrastructure, AI gadgets and the increasing demand for power are driving the current AI supercycle. The good thing is that we have relevant products to support this growth,” he said.
Teo said 20 to 30 per cent of the company’s revenue was currently related to AI applications, with AI components embedded across its latest equipment.
On employment, he said the company remained committed to developing Malaysian talent, with the majority of its management team comprising Malaysians.
“As we continue expanding, we believe this facility can be operated by Malaysians. We want to build our base here and develop local expertise,” he added.
-- BERNAMA